PKR 1200.00
WYLIE WL-225A 10cc lead-free, halogen-free soldering flux paste for IC soldering, BGA rework, and smartphone motherboard repair.
Overview
WYLIE WL-225A is a professional 10cc lead-free and halogen-free soldering flux paste designed for IC soldering, BGA rework, and fine-pitch PCB repairs. It promotes stable solder flow and proper wetting during heating, supporting clean and reliable solder joints on smartphone motherboards and other electronic assemblies.
Key Features
Lead-free and halogen-free flux formulation
10cc syringe packaging for controlled application
Suitable for BGA, SMT, and IC soldering
Supports fine-pitch PCB and motherboard work
Stable performance with hot air and soldering stations
Smooth paste consistency for precise placement
Benefits
Improves solder wetting and joint formation
Reduces solder bridging on fine pads
Enhances control during IC placement and reflow
Helps maintain PCB pad integrity
Suitable for professional micro-soldering tasks
Applications
BGA IC soldering and rework
Smartphone motherboard repair
IC reballing and replacement
Fine-pitch SMT component soldering
Precision micro-soldering operations
Compatible Models
Compatible with multiple smartphone motherboards and electronic PCBs.
FAQ Section
1. What does the WYLIE WL-225A flux paste do?
It improves solder flow and wetting during IC and BGA soldering.
2. What common repair issues does it help with?
Poor solder wetting, weak joints, and solder bridging.
3. Is it safe for smartphone motherboard repairs?
Yes, it is designed for fine-pitch and sensitive PCB work.
4. What skill level is required to use it?
Suitable for technicians with basic to professional soldering experience.
5. What repair outcome does it improve?
Clean, stable, and reliable solder joints.
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