JTX M29 IPX-17 middle layer reballing platform

PKR 16500.00

JTX M29 IPX-17 middle layer reballing platform with magnetic base for precise tin planting and BGA chip rework on smartphone motherboards.

Overview
The JTX M29 IPX-17 Middle Layer Reballing Platform is a professional repair tool engineered to support precise tin planting and BGA reballing tasks on smartphone and mobile device motherboards. Designed to serve the middle layer PCB stage, it provides a stable, magnetic surface with positioning modules that help align BGA stencils and chips for accurate reballing operations. This platform is especially useful for technicians performing surface-mount rework, CPU, RAM, and other fine-pitch component repairs.

Key Features

• Middle layer BGA tin planting reballing platform

• Magnetic base for secure placement and stability

• Precise positioning points for stencil alignment

• Supports a range of chip/tin sizes typical from IP X through 17 series

• High-quality steel and construction for professional use

• Rework-ready surface ideal for micro soldering workflows

Benefits

• Enables accurate and repeatable tin planting on mid layers

• Reduces misalignment during BGA reballing

• Secure magnetic hold minimizes movement under heat

• Supports cleaner and more uniform solder ball placement

• Designed for repeated professional repair bench use

Applications

• Middle layer BGA reballing on smartphone motherboards

• Tin planting for processor, RAM, and IC components

• PCB rework prep before hot-air or reflow soldering

• Precision micro-soldering tasks requiring stable fixture

• Part-level repair workflows in mobile device servicing

Compatible Models
Designed to support a wide range of smartphone models from iPhone X up through iPhone 17 Pro Max and similar Android middle-layer PCB configurations.

FAQ Section

1. What is the JTX M29 IPX-17 platform used for?
It is used as a stable fixture for middle layer BGA tin planting and reballing during smartphone PCB repair.

2. What repair problems does this tool help solve?
It minimizes stencil misalignment and solder ball displacement during reballing and BGA rework.

3. Is it compatible with modern phone motherboards?
Yes, it supports middle layer BGA layouts for models from iPhone X to iPhone 17 Pro Max.

4. Do I need special skills to use it?
Basic reballing and micro-soldering experience is recommended for effective use.

5. What repair outcome does it improve?
Cleaner, more accurate BGA reballing with consistent solder joint formation.