LUOWEI LW-PT03 double layer tin planting platform

PKR 2800.00

LUOWEI LW-PT03 double-layer tin planting platform with magnetic base and heat-resistant silicone pad for chip and BGA soldering tasks.

Overview
The LUOWEI LW-PT03 Double-Layer Tin Planting Platform is a multifunction soldering accessory designed to support precision soldering and reballing tasks on mobile phone motherboards and PCBs. It features a magnetic tin planting base and heat-resistant silicone pad that helps stabilize components and maintain accurate positioning during chip welding and BGA rework operations.

Key Features

• Double-layer tin planting platform for BGA and IC soldering

• Strong magnetic adsorption prevents steel mesh shifting

• Heat-resistant silicone pad with non-slip surface

• Aerospace-grade aluminum alloy base for durability

• Expandable base for versatile positioning

• Supports chips and components up to ~0.9 mm thickness

Benefits

• Provides a secure and stable surface for tin planting and reballing

• Reduces risk of shifting or misalignment during soldering

• Heat resistance up to high repair temperatures improves reliability

• Non-slip pad enhances precision during fine electronics work

• Durable materials ensure long service life

Applications

• BGA and IC chip tin planting and reballing

• PCB repair and micro soldering support

• Smartphone motherboard rework and chip alignment

• Heat-assisted soldering operations

• Component placement and stabilization

Compatible Models
Compatible with most smartphone motherboards and PCB components requiring tin planting and reballing support.

FAQ Section

1. What is the LW-PT03 tin planting platform used for?
It is used to support and stabilize components during tin planting, BGA reballing, and soldering work.

2. What makes its magnetic base useful?
Strong magnets ensure the soldering steel mesh and parts remain steady without shifting.

3. Can it withstand soldering heat?
Yes, the silicone pad is heat-resistant and non-slip for high-temperature applications.

4. Is it suitable for all chip sizes?
It supports most chips with thickness up to approximately 0.9 mm.

5. Does it help with accuracy?
Yes, its zero-error positioning and stable base improve solder placement precision.