YCS 0.45 mm BGA Solder Balls – 25 000 pcs IC Chip & Motherboard Reballing Repairing Materials

PKR 1200.00

Buy YCS 0.45 mm solder balls (25 000 pcs) for IC chip and BGA motherboard reballing. High-quality lead-tin alloy, precision size for reliable soldering repairs.

Overview

The YCS 0.45 mm BGA Solder Balls are engineered for precision IC chip and motherboard reballing. Packaged in a convenient bottle containing 25 000 micro solder spheres, they ensure consistent melting points and uniform ball size, which is essential for professional BGA repair work on mobile phones, laptops, and other electronics.

Key Features

• 0.45 mm Diameter – Ideal for micro-pitch BGA packages.

• 25 000 Pieces per Bottle – Long-lasting supply for multiple repairs.

• High-Purity Lead-Tin Alloy – Reliable bonding and conduction.

• Precision Manufacturing – Uniform size for consistent solder joints.

• Moisture-Proof Bottle – Keeps solder balls fresh and oxidation-free.

Benefits

• Professional-Grade Quality – Designed for technicians who demand accuracy.

• Cost-Efficient Bulk Packaging – Large quantity reduces frequent reordering.

• Easy Handling – Compact bottle for quick access during repairs.

• Improved Repair Success Rate – Reduces soldering defects and rework.

Applications

• Mobile Phone Motherboard Repair – For IC chips, CPU, and GPU reballing.

• Laptop & Console Repairs – Suitable for high-density BGA chipsets.

• Electronics Manufacturing & Prototyping – Ideal for small-pitch soldering.

• Hobby & DIY Electronics Projects – For fine soldering tasks at home or in workshops.