LUOWEI HS3 Preheating Platform 99W | Mobile PCB Layering & Glue Remover Tool

PKR 7000.00

Buy LUOWEI HS3 Preheating Platform with 99W constant temperature output for safe and efficient phone motherboard glue removal and PCB layering. Ideal for repair shops.

Product Overview

The LUOWEI HS3 Preheating Platform is a 99W high-efficiency tool designed for phone motherboard IC layering, glue removal, and tinning. With a uniform heating area of 65×100mm, this platform ensures safe and stable preheating, preventing damage to delicate components. Its aviation aluminum alloy build and constant temperature output make it an essential device for professional mobile phone repair.

Key Features

• 99W Constant Temperature Output – Delivers even heat distribution for safe glue removal.

• 65×100mm Heating Plate – Accommodates a wide range of phone motherboards.

• Triple-Layer Heat Insulation Design – Prevents overheating and reduces energy loss.

• Built-In Indicator Light – Real-time heating status monitoring.

• Aviation Aluminum Construction – Fast heat conduction and long-lasting durability.

• Plug and Play – No need for hot air guns or soldering irons.

Benefits

• Prevents overheating damage during IC removal.

• Accelerates tinning and pre-repair prep.

• Boosts repair efficiency in workshops and service centers.

• Reduces risk during CPU and NAND replacement.

• Compact and lightweight—ideal for mobile repair professionals.

Applications

• Preheating for motherboard CPU, NAND, and baseband IC removal.

• Glue degumming and cleaning for phone PCB layers.

• Tinning and preparation of pads before IC installation.

• Use in mobile repair labs, technician toolkits, and electronic refurbishing stations.

• LUOWEI HS3 preheating platform

• 99W phone PCB glue remover

• motherboard IC layering tool

• mobile repair glue removal platform

• constant temperature preheat plate