AMAOE 0.12mm BGA Stencil Reballing for Snapdragon 730 SM7150 IC Chip – Precision Stencil for BGA Rework BGA STENCIL/Reballing Plate Form

PKR 500.00

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Shop the AMAOE 0.12mm BGA Stencil for Snapdragon 730 SM7150 IC Chip at BilalGsm Pakistan. This precision laser-cut stencil ensures accurate reballing and effective BGA rework for Snapdragon chips.