High Quality BGA Reballing Stencil for Qualcomm MSM8953 CPU – Solve Capacitor Adsorption Tin BGA STENCIL/Reballing Plate Form

PKR 500.00

Qualcomm MSM8953 BGA stencil, high-quality BGA stencil, BGA reballing stencil, rework stencil for Qualcomm CPU, capacitor adsorption stencil, reballing tool, precision BGA stencil, BGA stencil for rework

Get the high-quality BGA reballing stencil for Qualcomm MSM8953 CPU at BilalGsm Pakistan. Perfect for solving capacitor adsorption tin issues, ensuring precise reballing and efficient rework.