AMAOE BGA stencil, reballing stencil, BGA CPU A14, MBGA-u30 B11 stencil, rework tool, steel BGA stencil, precision stencil, laser-cut BGA template, BGA reballing tool, BilalGsm Pakistan BGA STENCIL/Reballing Plate Form

PKR 500.00

Shop the AMAOE BGA Mbga-U30 Stencil for CPU A14 (0.12mm pitch) at BilalGsm Pakistan. Made from durable steel, this laser-cut stencil ensures high precision for BGA reballing. Available at the best price.

Overview:

The AMAOE BGA Mbga-U30 Stencil Reballing BGA CPU A14 0.12mm for MBGA-B11 is a high-quality, precision-crafted stencil designed for reballing BGA (Ball Grid Array) components. The product is made from durable steel that can withstand high temperatures and physical deformations, ensuring long-lasting performance during the reballing process. The stencils are laser-cut to offer high precision, making it easier for technicians to accurately position components during the reballing process. Available for purchase at BilalGsm Pakistan, this stencil is a cost-effective solution for BGA reballing operations.

Key Features:

1. High-Quality Steel Construction: The stencil is made from steel, which offers excellent resistance to both high temperatures and mechanical stress, ensuring durability and longevity.
2. Laser-Cut Precision: The stencils are precisely laser-cut, which ensures accurate placement of the BGA balls during the reballing process, improving overall precision and consistency.
3. Temperature Resistance: The steel material can handle the high temperatures involved in the reballing process without warping or deforming.
4. Compatible with BGA A14 0.12mm for MBGA-B11: Designed specifically for the A14 BGA CPU with 0.12mm pitch, making it ideal for Apple devices and other related applications.
5. Ease of Use: The template is designed for easy alignment during the reballing process, ensuring a smooth operation for technicians and engineers.

Benefits:

1. Improved Accuracy: The precision laser-cut holes ensure that the BGA balls are placed with high accuracy, reducing the chances of errors during reballing.
2. Durability and Longevity: Steel's high-temperature resistance and structural integrity mean that this stencil can be used repeatedly without loss of quality.
3. Cost-Effective: Available at a competitive price at BilalGsm Pakistan, offering an affordable solution for professionals in the mobile repair and electronics industry.
4. Reliable Performance: With excellent temperature resistance, it ensures consistent performance during the reballing process, which is crucial for repairing high-end electronics like mobile phones and CPUs.

Applications:

• Mobile Device Repair: Commonly used for reballing BGA components in mobile phones, especially Apple devices like iPhones.
• Electronics Manufacturing and Repair: Ideal for use in various fields involving BGA components, such as consumer electronics, laptops, and motherboards.
• CPU/Chipset Rework: Used in the reballing process of CPU chips, especially those with fine-pitch BGA connections.

This product is essential for professional technicians working with BGA rework and reballing, ensuring precision and reliability in the reballing process.