JTX Black Champion 138°C 183°C Solder Paste for Phone BGA IC Repair – Buy Online BGA SOLDERING FLUCKS AND BGA PASTE

PKR 1200.00

Buy JTX Black Champion Solder Paste (138°C, 183°C) for mobile phone BGA IC repair. Smooth flow, no residue, and perfect for chip reballing and motherboard soldering.

Overview

The JTX Black Champion 138/183°C Solder Paste is a high-performance reballing flux designed for precision work on BGA ICs and mobile phone motherboards. Engineered for fast melting and smooth flow, this solder paste ensures strong tin adhesion, no residue, and clean finishes. It is ideal for chip-level repairs and rework processes on smartphones, tablets, and small electronics.

Key Features

• Available in 138°C and 183°C melting points
  Suitable for both low-temp and standard-temp soldering needs.

• No residue after heating
  Leaves a clean board surface after soldering.

• Smooth tin flow
  Ensures clean joints and easy chip reballing.

• Anti-oxidation formula
  Prevents early drying and maintains paste quality.

• Stable viscosity
  No clogging or splatter during BGA rework.

• Easy to store and apply
  Comes in a compact container for technician convenience.

Benefits

• Reduces false soldering and improves rework efficiency

• Compatible with most BGA reballing stencils and stations

• Ensures secure solder joints with minimal risk of cracking

• Safe for multi-layer PCBs and sensitive components

• Trusted by mobile repair professionals for iPhone, Samsung, Xiaomi, and more

• Ideal for CPU, NAND, PM IC, U2, and BGA chip repair

Applications

• Reballing and soldering BGA chips on mobile phones

• Used in IC replacement and motherboard-level repair

• Compatible with SMD/SMT repair stations

• Suitable for use on CPU, baseband, NAND, and power ICs

• JTX Black Champion solder paste for BGA IC repair

• 138°C solder paste for phone motherboard

• 183°C solder paste for chip reballing

• Buy JTX Black Champion tin paste online

• Solder paste for mobile CPU and NAND chip