PKR 15000.00
Amaoe X-16 middle layer reballing platform with 28-in-1 fixtures for precise solder ball alignment in mobile phone PCB repair.
The Amaoe X-16 Middle Layer Reballing Platform 28 in 1 is a precision reballing fixture designed for middle-layer IC and PCB rework in mobile phone motherboard repair. It provides stable positioning and accurate alignment during solder ball placement, helping technicians maintain consistent spacing and uniform solder joints when working on multilayer boards.
Precision-machined reballing platform for middle-layer work
Includes 28 interchangeable positioning fixtures
Rigid metal structure for heat stability
Accurate alignment slots for solder ball placement
Designed for controlled reballing workflows
Suitable for repeated professional repair use
Improves accuracy during middle-layer reballing
Helps maintain uniform solder ball distribution
Reduces misalignment and rework risk
Supports stable handling during heating processes
Enhances consistency in multilayer PCB repairs
Middle-layer PCB reballing
IC and BGA solder ball placement
Smartphone motherboard repair
Multilayer board rework
Hot air and controlled heating processes
Compatible with multiple smartphone models and general electronics repair.
1. What does this reballing platform do?
It holds and aligns middle-layer ICs or PCB sections during solder ball placement.
2. When do technicians use this platform?
It is used during reballing stages of motherboard and multilayer PCB repair.
3. Is it suitable for different devices?
Yes, it supports various smartphone and electronics repair tasks.
4. Does it require advanced repair skills?
Basic reballing knowledge is recommended, but the platform itself is straightforward to use.
5. How does it improve repair outcomes?
It helps achieve accurate solder alignment, reducing joint defects and repeat repairs.
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