Keguan iPhone 18 Series Motherboard Heating Module for PCB IC Repair Preheating

Name: Keguan iPhone 18 Series Motherboard Heating Module for PCB IC Repair Preheating
Brand: Keguan
SKU: 4295
Price: 3000.00 PKR
Availability: InStock

Keguan

heating modules

Keguan iPhone 18 Series Motherboard Heating Module is designed for controlled PCB preheating during professional iPhone motherboard repair. It helps provide even heat distribution for IC, CPU, BGA and microsoldering work while reducing thermal stress during component removal and installation. Available at BilalGSM Store.ApplicationsiPhone 18 series motherboard repairPCB preheatingIC and CPU reworkBGA repair and reballingMicrosolderingComponent removal and installationMotherboard layer and chip-level repairCompatibilityApple iPhone 18 Series motherboardsCompatible with Keguan heating and preheating systemsVerify the exact iPhone 18 model and heating module version before use.