Keguan iPhone 18 Series CPU Stencil for IC Reballing Motherboard Repair

Keguan

BGA STENCIL/Reballing Plate Form

Keguan iPhone 18 Series CPU Stencil is a precision BGA reballing stencil designed for professional CPU repair, tin planting and motherboard-level microsoldering. It helps technicians achieve accurate solder ball placement during advanced iPhone CPU rework. Available at BilalGSM Store.ApplicationsiPhone 18 Series CPU reballingCPU IC tin plantingBGA reballingMotherboard repairCPU replacement and refurbishmentMicrosoldering and chip-level repairCompatibilityiPhone 18 Series