Keguan Desoldering Wick 1.5mm 2mm 3mm Solder Braid for PCB IC BGA Repair

Keguan

desoldering wire

Keguan Desoldering Wick is a professional solder braid designed for fast and controlled removal of excess solder from ICs, SMD components, PCB pads and motherboard circuits. Available in 1.5mm, 2.0mm and 3.0mm widths for different repair applications. Available at BilalGSM Store.Size Options1.5mm Desoldering WickBest for fine-pitch ICs, small SMD components, FPC connectors and precision microsoldering.2.0mm Desoldering WickIdeal for general IC, SMD and motherboard solder removal and everyday mobile repair work.3.0mm Desoldering WickSuitable for larger solder pads, wider connections, power lines and areas requiring higher solder absorption.ApplicationsMobile phone motherboard repairIC and CPU reworkBGA reballing preparationSMD component repairPCB solder removalFPC and connector repairRemoving excess solder from padsMicrosoldering and chip-level repairTechnical SpecificationsBrand: KeguanProduct Type: Desoldering WickMaterial: Braided CopperWidth Options: 1.5mm, 2.0mm, 3.0mmApplication: PCB, IC, SMD, BGA and mobile phone repairPackage includes1x keguan desoldering wire of your chosen width size