WL HT007 X-17 Pro Max Preheating Groove Mold Desoldering Station for iPhone Motherboard Repair

WYLIE

heater

WL-HT007 X-17 Series Pre-Heating Groove Mold Desoldering Station is designed for professional iPhone layered motherboard repair, tin planting, bonding and desoldering. Its intelligent layered heating, precise temperature control, high heating efficiency and energy-saving hibernation function make it suitable for advanced motherboard and BGA repair workflows. Available at BilalGSM Store.Technical SpecificationsBrand: WLModel: HT007Product Type: Preheating Groove Mold Desoldering StationHeating System: Intelligent Layered HeatingTemperature Control: Precision Temperature RegulationFunction: Preheating, Desoldering, Tin Planting and BondingHibernation: SupportedApplication: iPhone layered motherboard repairIntelligent Layered HeatingThe WL HT007 uses intelligent layered heating technology to provide controlled and even heat distribution for complex iPhone motherboard repair, desoldering and rework applications.Precision Temperature ControlPrecise temperature regulation helps technicians control the heating process during tin planting, bonding and layered motherboard rework while reducing the risk of excessive heat exposure to sensitive components.High-Efficiency HeatingThe high-efficiency heating system is designed to provide rapid warm-up and stable heating performance, helping improve workflow efficiency during repeated motherboard repair operations.Energy-Saving HibernationThe built-in hibernation function reduces power consumption when the station is idle and helps support safer operation during extended repair sessions.