Keguan
Keguan W10 Universal Stencil for Tin Planting Mobile Repair
BGA STENCIL/Reballing Plate Form
Buy Keguan W10 Universal Stencil for tin planting, IC reballing and BGA repair. Precision stencil for mobile phone motherboard and chip repair from BilalGSM Pakistan. Key Features Original Keguan W10 Universal Stencil Designed for tin planting and IC reballing Suitable for BGA chip repair Precision stencil design Ideal for mobile motherboard repair Reusable repair tool Professional repair grade Compatibility Android motherboard repair iPhone motherboard repair IC reballing BGA chip repair CPU and RAM reballing Mobile phone motherboard work The Keguan W10 Universal Stencil is a precision stencil designed for tin planting, IC reballing and BGA chip repair. It helps technicians accurately apply solder balls or tin to ICs during mobile phone motherboard repair and is suitable for professional chip level work.
Wholesale price: PKR 700.00
In stock for delivery across Pakistan.